A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability

PROJECT TITLE:

A Comparison of Alloy-Surface Finish Combinations Considering Different Component Package Types and Their Impact on Soldering Reliability

ABSTRACT:

Reliability specifications for solder joints, along with for all electronic parts, became a elementary feature in the qualification of an electronic product. The relevance of those reliability features increases if new elements or materials are considered. In this analysis activity, an accelerated thermal take a look at on customized electronic boards was implemented for an early reliability evaluation; we have a tendency to so proposed a study on the reliability behavior of a solder joint by considering completely different surface finishes, and many part packages. A comparative study was disbursed through the application of statistical strategies. To this finish, Weibull distributed information and non-linear mixed models were evaluated. More precisely, Weibull random-effects models were applied to check completely different mixtures of surface finishes, (e.g. Hot Air Solder Leveling, Electroless Nickel Immersion Gold, Immersion Tin) and alloys, (e.g. tin-silver-copper, tin-lead), connected to four types of parts, additionally to evaluate how the sort of package or the geometry of the joint may affect the reliability of the soldering. So, the aim of this research could be a statistical study of the reliability of solder alloys subjected to thermal aging tests by additionally taking completely different surface finishes of the printed circuit boards and different sorts of packaging under consideration. The study was carried out with 2-by-2 comparisons of alloy-surface finishes. By evaluating the statistical results, the tin-silver-copper alloy, with the thought of finishes, demonstrates a higher reliability with respect to the boards soldered by the ancient combination of soldering alloy and surface finish.

Did you like this research project?

To get this research project Guidelines, Training and Code… Click Here

COMMENTS :

Leave a Reply

Your email address will not be published. Required fields are marked *

three + four =